Process of removing a ceramic coating deposit in a surface hole of a component
US6847004B2 · kind B2 · utility
14Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2003 |
| Grant date | Jan 25, 2005 |
| Priority date | — |
| Expiry date | Sep 21, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23P2700/06
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A process of removing ceramic deposits from a surface hole in a component, a particular example being portions of a ceramic coating deposited on a surface of a component equipped with cooling holes. The process makes use of a pulsed Nd:YAG laser operated with parameters that avoid delamination, cracking or otherwise damaging a ceramic coating surrounding a cooling hole. The laser is operated to generate a laser beam that removes some of the ceramic deposit from the hole while a residual portion of the ceramic deposit remains surrounding the hole to define a surface opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.