Laser cutting method
US6847005B2 · kind B2 · utility
3Cited by
8References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 3, 2002 |
| Grant date | Jan 25, 2005 |
| Priority date | — |
| Expiry date | Oct 3, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/073
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser cutting device and method using a laser beam passing through an optical device producing a focal spot with a diameter between about 1.5 and 3 mm, and using a working gas flow. According to the device and method, the working gas flow is ejected from a nozzle at a pressure of between about 1 and 3 bars.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.