Semiconductor device and package product of the semiconductor device
US6847121B2 · kind B2 · utility
6Cited by
1References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2002 |
| Grant date | Jan 25, 2005 |
| Priority date | — |
| Expiry date | Aug 20, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes, a circuit constituting section having a function circuit and an externally-drawing electrode, connected to the function circuit, on a surface of the circuit constituting section. An insulating layer is provided on a side of a rear surface of the circuit constituting section. The insulating layer has a face opposite to the circuit constituting section, which has an area that is larger than an area of the rear surface of the circuit constituting section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.