Integrated power amplifier module with power sensor
US6847262B2 · kind B2 · utility
20Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2004 |
| Grant date | Jan 25, 2005 |
| Priority date | — |
| Expiry date | Jun 14, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A power amplifier module for amplifying radio frequency signals includes first, second, third and fourth corner ground pads positioned at each corner of the power amplifier module; a radio frequency input pad positioned between the first and second corner ground pads; a radio frequency output pad positioned between the third and fourth corner ground pads; and a power amplifier circuit centrally positioned on the power amplifier module, the power amplifier having an input coupled to the radio frequency input pad and an output coupled to the radio frequency output pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.