Interconnect module with reduced power distribution impedance
US6847527B2 · kind B2 · utility
78Cited by
33References
63Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2002 |
| Grant date | Jan 25, 2005 |
| Priority date | — |
| Expiry date | Jun 4, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An interconnect module for an integrated circuit chip incorporates a thin, high dielectric constant embedded capacitor structure to provide reduced power distribution impedance, and thereby promote higher frequency operation. The interconnect module is capable of reliably attaching an integrated circuit chip to a printed wiring board via solder ball connections, while providing reduced power distribution impedance of less than or equal to approximately 0.60 ohms at operating frequencies in excess of 1.0 gigahertz.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.