Method of manufacturing a surface acoustic wave device
US6848153B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2002 |
| Grant date | Feb 1, 2005 |
| Priority date | — |
| Expiry date | Dec 10, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49798
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of a surface acoustic wave device which includes a step of applying a photosensitive film resist on a substrate and forming a photosensitive film resist layer over at least a portion of a surface of the substrate; a step of forming acoustic absorbers only at the two sides orthogonal to the direction of the surface acoustic wave transmission; a step of placing in a package a surface acoustic wave element obtained by cutting and dividing the substrate and electrically connecting a connection electrode of the surface acoustic wave element with an external terminal of the package; and a step of sealing an opening of the package with a lid, wherein the main surface of the acoustic absorbers is formed parallel to the surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.