Mechanical deformation amount sensor
US6848320B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 29, 2003 |
| Grant date | Feb 1, 2005 |
| Priority date | — |
| Expiry date | May 29, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/956
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A mechanical deformation amount sensor includes a sensor structure which is formed by a semiconductor substrate or an insulating substrate and integrally includes a deformation portion deformable, when a physical quantity to be detected is applied to the sensor structure, due to the physical quantity and a support portion for supporting the deformation portion, a carbon nanotube resistance element which is provided on the deformation portion so as to be mechanically deformed in response to deformation of the deformation portion and a wiring pattern which is formed in a pattern on the sensor structure so as to be connected to the carbon nanotube resistance element. By applying a voltage to the carbon nanotube resistance element via the wiring pattern, a change of electrical conductivity of the carbon nanotube resistance element upon mechanical deformation of the carbon nanotube resistance element is fetched as an electrical signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.