Adhesiveless microfluidic device fabrication

US6848462B2 · kind B2 · utility

Assignee

• Nanostream, Inc. · US

Inventors

• Joseph F. Covington · San Gabriel, US
• Steven Hobbs · Calabasas, US
• Jeffrey Alan Koehler · Pasadena, US
• Paren P. Patel · Sierra Madre, US
• Marci Pezzuto · Pasadena, US
• Mark S. Scheib · La Verne, US

Key dates

• Filing date: Dec 6, 2002
• Grant date: Feb 1, 2005
• Expiry date: Aug 1, 2023

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T137/598
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A method for fabricating a microfluidic device where first and second substantially flat platens are provided. Multiple substantially planar, substantially metal-free, adhesiveless polymer device layers, the device layers including a first cover layer, second cover layer, and at least one stencil layer defining a microfluidic channel penetrating through the entire thickness of the stencil layer also are provided. Each stencil layer is disposed between other device layers such that the channel is bounded laterally by a stencil layer, and bounded from above and below by surrounding device layers to define an upper channel surface and a lower channel surface. The device layers are stacked between the first platen and the second platen. The stacked device layers are controllably heated according to a heating profile adapted to form a substantially sealed adhesiveless microfluidic device wherein each upper channel surface remains distinct from its corresponding lower channel surface. The resulting microfluidic device has high inter-layer bond strength while preserving the integrity of the channel(s) defined in the stencil layer(s).