Method of bonding sputtering target materials
US6848608B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 29, 2003 |
| Grant date | Feb 1, 2005 |
| Priority date | — |
| Expiry date | Sep 29, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/3414
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of forming a sputtering target is described that involves bonding a backing plate onto a casement having one or more recesses that contain target material to form a bonded target. During the bonding process, the bonded target is optionally vacuum sealed within the recess. The bonded target is then optionally annealed while under vacuum to form an annealed sputtering target. The sputtering target can then be retrieved by removing at least a portion of the casement from the sputtering target in one or several steps. Also described is a casement having one or more recesses containing bonded target material that is optionally vacuum sealed in the casement. The casement, as well as the backing plate that is optionally bonded onto the casement, are further described as well as other options and methods.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.