Electrochemical microsensor package

US6849168B2 · kind B2 · utility

Assignee

• KVAL, INC. · US

Inventors

• William F. Crumly · Anaheim, US
• Marc J. Madou · San Diego, US

Key dates

• Filing date: Nov 9, 2001
• Grant date: Feb 1, 2005
• Expiry date: Apr 22, 2023

Classification

• Technology area (CPC G): Physics
• CPC primary: G01N27/403
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

An electrochemical microsensor package comprises a substrate matrix having a upper non-conductive layer and an adjacent lower non-conductive layer with a conductive trace or pad extending over an area therebetween. The conductive pad has integral therewith a projecting contact button that projects through and below the second non-conductive for making contact with external electrical contacts. A sensor electrode is positioned on the surface of the conductive pad toward the upper non-conductive layer and in electrical contact therewith. A well extends through the upper non-conductive layer to the upper surface of the electrode. The microsensor packages may be produced by electrodeposition of the conductive pad onto a conductive mandrel having depressions to form the contact button.The microsensor package is fabricated into a microsensor by appropriate adaptation of the well of the microsensor package including applying an appropriate oxide or other layer over the electrode, introduction of an electrolyte or other sensing chemicals into the well and or applying a permeable or impermeable membrane over the top of the well.