Process for making microdevice with movable microplatform
US6849170B2 · kind B2 · utility
6Cited by
13References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2003 |
| Grant date | Feb 1, 2005 |
| Priority date | — |
| Expiry date | Jan 27, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/053
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process for making a microdevice that includes the steps of providing a base member and selectively electroforming a support member for supporting a microplatform with respect to the base member. The process also includes the steps of selectively electroforming the microplatform and forming a flexible hinge member for hingedly connecting the microplatform to the support member and allowing relative movement of the microplatform with respect to the support member. This microdevice, when compared to prior art devices, can have improved mechanical strength, rigidity, low deformation, and high planarity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.