Stamper-forming electrode material, stamper-forming thin film, and method of manufacturing optical disk
US6849390B2 · kind B2 · utility
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3Claims
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Key dates
| Filing date | Feb 4, 2002 |
| Grant date | Feb 1, 2005 |
| Priority date | — |
| Expiry date | Jan 11, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/032
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A stamper-forming electrode material contains Cu as its main ingredient and at least one other element, preferably Ag and/or Ti. It is preferred that the Ag content be 10.0 wt % or less and that the Ti content be 5.0 wt % or less. A stamper-forming thin film is made of this stamper-forming electrode material, whereby its corrosion resistance is improved to suppress damage to itself, and a high-quality stamper can hence be formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.