Printed wiring board and electronic apparatus
US6849805B2 · kind B2 · utility
20Cited by
6References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2001 |
| Grant date | Feb 1, 2005 |
| Priority date | — |
| Expiry date | Dec 20, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed wiring board is provided in which lift-off and land peeling do not occur during soldering of an inserted component onto the printed wiring board, and hence pattern breakage does not occur, but with no increase in cost. A plurality of lands 6 are each formed continuously across surfaces of a substrate and an inner peripheral surface of one of a plurality of soldering through holes 5 into which leads 2 of an inserted component 3 to be mounted onto the printed wiring board are inserted before soldering is carried out, and a solder resist 8 is coated onto the lands 6.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.