Method of adhesive bonding by induction heating
US6849837B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2003 |
| Grant date | Feb 1, 2005 |
| Priority date | — |
| Expiry date | Sep 12, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K13/01
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for using magnetic fields to heat magnetically susceptible materials within and/or adjacent to adhesives, so as to bond, bind, or fasten solid materials to one another. The system uses alternating magnetic fields that induce eddy currents and generate heat within susceptors. An induction heating tool is used to emit the magnetic field at its work coil, and an electronic controller measures the energy being used by a power converter that generates the alternating current driving the work coil which creates the magnetic field. The heating tool is used in a method of adhesive bonding in which the thickness of the conductive layer of the susceptor is in the range of 0.01-3.0 mils, or the heating event time interval is in the range of 0.05-10.0 seconds, or the average power density of the magnetic field at the susceptor is in the range of 10-5000 Watts per square inch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.