IC package substrate with over voltage protection function
US6849954B2 · kind B2 · utility
2Cited by
12References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 15, 2002 |
| Grant date | Feb 1, 2005 |
| Priority date | — |
| Expiry date | Dec 14, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16225
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to an IC package substrate provided with over voltage protection function and thus, a plurality of over voltage protection devices are provided on a single substrate to protect an IC chip directly. According to the present invention, there is no need to install multiple protection devices on a printed circuit board. Therefore, the costs to design circuits are reduced, the limited space is effectively utilized, and unit costs to install respective protection devices are lowered down.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.