Sandwich holographic disk construction with thin molded substrates
US6850345B2 · kind B2 · utility
2Cited by
33References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2004 |
| Grant date | Feb 1, 2005 |
| Priority date | — |
| Expiry date | Feb 18, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S359/90
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In one embodiment, holographic data storage medium includes a first thermoplastic substrate portion having a thickness less than approximately 2 millimeters and a second thermoplastic substrate portion having a thickness less than approximately 2 millimeters. A holographic recording material may be sandwiched between the first and second thermoplastic substrate portions. By making thermoplastic substrate portions sufficiently thin, edge wedge problems can be avoided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.