Wire reduction device
US6851293B2 · kind B2 · utility
1Cited by
13References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 2003 |
| Grant date | Feb 8, 2005 |
| Priority date | — |
| Expiry date | May 27, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB21C9/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A device re-shapes formed wire after processes such as annealing where wire is wound on bobbins. The device includes a reservoir for containing lubricant having a first open end and a second open end. The first end of the reservoir is closed by a guide mechanism for guiding the wire into the reservoir. The second end of the reservoir is closed by a wire shaping for shaping the wire when the wire is pulled therethrough. The wire shaping mechanism reduces the cross-sectional area of the wire by no more than 24%.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.