Apparatus for determining residual stress, method for determining residual stress data using it, residual stress determining method using it and recording medium thereof
US6851300B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2003 |
| Grant date | Feb 8, 2005 |
| Priority date | — |
| Expiry date | Apr 29, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2203/008
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed herein is an apparatus for measuring residual stress, methods of measuring residual stress data and residual stress using the apparatus, and a recording medium for storing software of the residual stress measuring method. The present invention is advantageous for evaluation of a mechanical material property and is non-destructive. Further, the present invention is widely applied to fields ranging from a microscopic area, such as a thin film or micro device, to a large-sized structure, and is not influenced by a microstructure by controlling the range of an applied load. Further, the measuring apparatus of the present invention is minimized in its volume to be easily attached to an actual structure. Further, in the present invention, various attaching devices are employed, thus enabling the apparatus to be attached to various materials regardless of the size and type of object materials to measure residual stress. Further, the measuring apparatus of the present invention is horizontally movable, so there is no need to move an apparatus body itself so as to take measurements at several positions of several materials. Further, the present invention does not require separate …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.