Close packing LED assembly with versatile interconnect architecture
US6851831B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 16, 2002 |
| Grant date | Feb 8, 2005 |
| Priority date | — |
| Expiry date | Sep 4, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S362/80
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A modular mounting assembly (10) for connecting a plurality of LEDs in a selectable electrical and spatial arrangement includes a plurality of substrates (12) each having at least one LED (14a, 14b) fixedly arranged thereon, and a plurality of connectors (16) arranged thereon that are in operative communication with the at least one LED (14a, 14b) fixedly arranged thereon. The plurality of substrates (12) are arranged in a selected spatial arrangement having selected pairs of connectors (16) in operative communication with each other to effectuate electrical connection therebetween, whereby an electrical arrangement of the plurality of LEDs is effectuated. A plurality of interconnecting elements (50A, 50D, 50S, 50P) electrically and structurally interconnect selected spatially adjacent substrates (12) in cooperation with the selected pairs of connectors. A connector (16) has a plurality of electrical conductor members (1, 2, 3, 4, 5), and an interconnecting element (50) has a selected electrical configuration that effectuates a selected interconnection of conductor members (1, 2, 3, 4, 5).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.