Methods and systems of producing blister packaging
US6851874B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2002 |
| Grant date | Feb 8, 2005 |
| Priority date | — |
| Expiry date | Feb 7, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65B9/04
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A blister packaging production line preferably includes an unmarked supply of backing for blister packaging, a printer for selectively printing on the backing and a host system controlling the printer and providing a variety of desired designs to the printer. The design being printed on the backing can be changed on-demand by transmitting a new design from the host system to the printer. Additionally, a blister packaging production line may include an unmarked supply of material backing for blister packaging, a printer for selectively printing on the material and a shaping device for forming recesses in the material that will receive items being blister packaged. The printed design can be of any desired length.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.