High-density connector assembly with improved mating capability
US6851980B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2002 |
| Grant date | Feb 8, 2005 |
| Priority date | — |
| Expiry date | Nov 29, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/6587
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A connector assembly is suitable for connecting circuit boards together. The connector assembly includes a series of ground and signal terminal sets assembled in composite wafers that may be held within a housing. The ground terminals include pairs of flat contact blades that are aligned together in abutting contact to form a column of ground contacts blades of double width, and the signal terminals are arranged in sets on opposite sides of the ground terminal blades and the signal terminals have general L-shapes that are arranged in sets of two pairs of contacts to form a cruciform pattern. One of the two connectors has solid L-shaped contacts, while the other of the two connectors has a pair of split contact arms that lie and extend in two different planes project from an associated terminal body in a manner so as to mate with the contact portions of the solid L-shaped contacts. The use of L-shaped contacts provides a redundant contact mating arrangement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.