Polishing composition and polishing method employing it
US6852009B2 · kind B2 · utility
18Cited by
11References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2002 |
| Grant date | Feb 8, 2005 |
| Priority date | — |
| Expiry date | May 6, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A polishing composition which comprises the following components (a) to (d):
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.