Patent · US Expired

Sputter target and method of using a sputter target

US6852201B2 · kind B2 · utility

6Cited by

2References

8Claims

0Family size

Assignee

CemeCon AG · DE

Inventors

Bernd Hermeler · Aachen, DE
Alexander Wuropulos · Aachen, DE

Key dates

Filing date	Aug 7, 2001
Grant date	Feb 8, 2005
Priority date	—
Expiry date	Aug 7, 2021

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC23C14/3414
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A sputtering target used in carrying out a PVD coating process where the sputtering target is sputtered by bombardment with gas atoms and a layer consisting of several metallic elements is deposited onto a substrate, the sputtering target being a plate made of a metal used for building up the layer, and with the other metals used for building up the layer being present at least partially in the form of plugs, which are inserted in holes in the plate, the shape of the free surfaces of the plugs being selected in such a way that the sputtering rate for each metal used in the sputtering process can be set according to the desired composition of the layer being applied.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.