Plating method and plating bath precursor used therefor
US6852210B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 7, 2002 |
| Grant date | Feb 8, 2005 |
| Priority date | — |
| Expiry date | Sep 21, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12951
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a redox system of a plating bath from a lower oxidation state to a high oxidation state, and second metal ions of said redox system are reduced and deposited onto the surface of an object to be plated, wherein a process is provided in which by supplying the electrical current to the plating bath, the first metal ions are reduced from said lower oxidation state to thereby activate the plating bath. The plating bath precursor is formed stabilizing the plating bath so that reduction and deposition of the second metal ions substantially do not occur in order to improve its storing performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.