Casting compound based on thermosetting epoxy resins
US6852415B2 · kind B2 · utility
1Cited by
10References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2003 |
| Grant date | Feb 8, 2005 |
| Priority date | — |
| Expiry date | Mar 12, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The curable casting compound comprises an epoxy resin having at least one aminoglycidyl group in the molecule, a curative, and a fluorosurfactant. In the manufacture of products based on this casting compound, the shaping and curing operation can be shortened considerably.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.