Method for operating chemical mechanical polishing (“CMP”) tool for the manufacture of semiconductor devices
US6852633B2 · kind B2 · utility
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3References
21Claims
0Family size
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Key dates
| Filing date | Mar 8, 2004 |
| Grant date | Feb 8, 2005 |
| Priority date | — |
| Expiry date | Mar 8, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/959
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for processing integrated circuit devices including a water recycling process. The method includes operating a chemical mechanical planarization process, which includes a discharge for process water. The process water is used to process one or more semiconductor wafers. The method also selectively discharges process water from the discharge. A step of transferring the process water from the chemical mechanical planarization process to a facility process is included. The method then uses the discharged water in the facility process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.