Laser-induced plasma micromachining
US6852946B2 · kind B2 · utility
32Cited by
4References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2002 |
| Grant date | Feb 8, 2005 |
| Priority date | — |
| Expiry date | Dec 20, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23F4/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and system for laser ablating a target material in an ambient atmosphere are disclosed. The method includes generating one or more laser pulses, each of the laser pulses having a pulse width of 1 picosecond (ps) or less and a pulse energy of 50 micro joules (μJ) or more. The laser pulses are directed towards the target material such that the laser pulses interact with a gas to form a plasma. The plasma removes a portion of the target material by interaction of the plasma with the target material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.