Dual power supply method and apparatus
US6853061B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2002 |
| Grant date | Feb 8, 2005 |
| Priority date | — |
| Expiry date | Oct 18, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to apparatus and methods for providing a low resistance power supply to a microelectronic package through the use of dual conductive paths. A first conductive path contained within the substrate and supplies current, primarily in responding to transient current demands to the microelectronic package. A lower resistance second conductive path supplies primarily steady state current to the microelectronic package through an electrical connection to an edge of the microelectronic package. Resistance in the second conductive path is reduced by using a power clamp to connect the second power supply to the microelectronic package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.