Semiconductor module and method for fabricating the semiconductor module
US6853088B2 · kind B2 · utility
1Cited by
6References
8Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 24, 2002 |
| Grant date | Feb 8, 2005 |
| Priority date | — |
| Expiry date | Jan 24, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0306
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor module and a method for its fabrication are described. The semiconductor module has at least one semiconductor component that is disposed directly on a substrate body. The substrate body has an insulating ceramic provided with a metal layer. At least one connection conductor is joined to the metal layer by welding, in particular laser microwelding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.