Circuit board, mounting structure for semiconductor device with bumps, and electro-optic device and electronic device
US6853092B2 · kind B2 · utility
7Cited by
0References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 9, 2003 |
| Grant date | Feb 8, 2005 |
| Priority date | — |
| Expiry date | Oct 9, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a circuit board including a plurality of pads for mounting a semiconductor device with bumps and a plurality of wires drawn from the respective pads, a mounting structure for the semiconductor device with bumps, and an electro-optic device and an electronic device. The circuit board has a region where the pitch in the longitudinal direction and the lateral direction of the plurality of pads are different from each other and the wires are preferentially drawn from a wider pitch side of the longitudinal direction or the lateral directions of the pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.