Apparatus and method for coupling light between an optical resonator and a semiconductor chip with a minimum number of components and alignment steps
US6853479B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2002 |
| Grant date | Feb 8, 2005 |
| Priority date | — |
| Expiry date | Feb 21, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/266
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A system includes an electro-absorptive modulator having opposing surfaces, a first semiconductor optical amplifier having opposing surfaces, a photodetector having opposing surfaces, a second semiconductor optical amplifier having opposing surfaces, a microwave link, and an optical resonator. One of the opposing surfaces of the first semiconductor optical amplifier is coupled to one of the opposing surfaces of the electro-absorptive modulator. One of the opposing surfaces of the second semiconductor optical amplifier is coupled to one of the opposing surfaces of the photodetector. The microwave link is coupled between the photodetector and the electro-absorptive modulator. The optical resonator is for coupling evanescent components of light propagated between the first semiconductor optical amplifier and the second semiconductor optical amplifier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.