Methods and apparatus for decoupling circuit board connectors
US6853556B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 12, 2004 |
| Grant date | Feb 8, 2005 |
| Priority date | — |
| Expiry date | Jan 12, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/633
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A motherboard assembly includes a motherboard, a circuit board, and an ejector assembly. The motherboard has a motherboard connector extending from a planar surface of the motherboard. The circuit board has a circuit board connector extending from a planar surface of the circuit board and coupled to the motherboard connector of the motherboard such that the planar surface of the circuit board orients substantially parallel to the planar surface of the motherboard. The ejector assembly orients between the motherboard and the circuit board. During an ejection procedure, the ejector assembly separates the motherboard connector and the circuit board connector while minimizing bending of either the circuit board or the motherboard. By limiting bending of either the circuit board or the motherboard, the ejector assembly minimizes damage to electrical traces or components carried by either the circuit board or the motherboard during the separation process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.