Nozzle for ejecting molten metal
US6854671B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 22, 2002 |
| Grant date | Feb 15, 2005 |
| Priority date | — |
| Expiry date | May 29, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05B1/02
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A nozzle ejects molten metal in an ejecting direction. The nozzle has a solder-philic surface in a first region and a solder-repellent surface in a second region. The second region is located forward of the first region in the ejecting direction. Before molten metal is ejected, the peripheral edge of the liquid surface of the molten metal is held at a position located further forward in the ejecting direction than the boundary between the solder-philic surface and the solder-repellent surface. The peripheral edge of the liquid surface is thus held before being ejected so that solder drops can be ejected steadily with a uniform diameter, constant direction, and constant speed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.