Patent · US Expired

Thermal injection and proportioning head, manufacturing process for this head and functionalization or addressing system comprising this head

US6854830B2 · kind B2 · utility

3Cited by
1References
26Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 12, 2001
Grant dateFeb 15, 2005
Priority date
Expiry dateJul 12, 2021

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01N2035/1041
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

Injection and proportioning head with at least one thermal injection and proportioning device to supply a determined quantity of liquid, comprising: Process for manufacturing this head.Functionalisation or addressing system, particularly for chemical or biochemical micro reactors comprising this head.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.