Sinter-bonded direct pin connections for inert anodes
US6855234B2 · kind B2 · utility
23Cited by
11References
23Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 2, 2003 |
| Grant date | Feb 15, 2005 |
| Priority date | — |
| Expiry date | Apr 2, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53204
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A sintered electrode assembly is made of an inert electrode (15) containing a sealed metal conductor (20) having a surface feature (30) such as a coating or wrapping which aids in bond formation with the inert electrode (15) at their interface (45), where the metal conductor (20) is directly contacted by and is substantially surrounded by the inert electrode (15) without the use of metal foam or metal powders.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.