Process for reducing the passive layer from the surface of a metal
US6855259B2 · kind B2 · utility
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20References
20Claims
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Assignee
Inventor
Key dates
| Filing date | Aug 1, 2002 |
| Grant date | Feb 15, 2005 |
| Priority date | — |
| Expiry date | Jul 25, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/20
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present invention is directed to a process for reducing the passive layer on a metal. The process includes reacting a treatment composition having a non-metallic compound with metal ions in the passive layer of a metal, thereby forming an organometallic complex precipitate, and removing the organometallic complex precipitate. In one embodiment the non-metallic compound is a thiuram. In another embodiment, the treatment composition further includes a non-metallic compound that is a dithiocarbamate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.