Method for producing a microstructured surface relief by embossing thixotropic layers

US6855371B2 · kind B2 · utility

Assignee

• Institut fuer Neue Materialien gemeinnuetzige GmbH · DE

Inventors

• Andreas Gier · Melle, DE
• Nora Kunze · Völklingen, DE
• Martin Mennig · Idar-Oberstein, DE
• Peter W. Oliveira · Riegelsberg, DE
• Stefan Sepeur · Wadgassen, DE
• Bruno Schaefer · Losheim, DE
• Helmut Schmidt · Riegelsberg, DE

Key dates

• Filing date: Jan 12, 2001
• Grant date: Feb 15, 2005
• Expiry date: Jul 1, 2021

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B05D1/42
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A method is described for producing a microstructured surface relief by applying to a substrate a coating composition which is thixotropic or which acquires thixotropic properties by pretreatment on the substrate, embossing the surface relief into the applied thixotropic coating composition with an embossing device, and curing the coating composition following removal of the embossing device. The substrates obtainable by this method, provided with a microstructured surface relief, are particularly suitable for optical, electronic, micromechanical and/or dirt repellency applications.