Method for improving the uniformity of a wet coating on a substrate using at least two wire-wound rods
US6855374B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 10, 2002 |
| Grant date | Feb 15, 2005 |
| Priority date | — |
| Expiry date | Nov 6, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05C5/0208
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Continuous void-free uniform coatings are formed on substrates by repeatedly contacting the substrate at a first position with wetted surface portions of at least two rotating wire-wound coating rods and re-contacting the substrate with such wetted surface portions at a different position or positions on the substrate. The coating is repeatedly picked up from and placed onto the substrate and made more uniform. Extremely uniform and extremely thin coatings can be quickly and easily obtained using low cost equipment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.