Printing of electronic circuits and components
US6855378B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 24, 1998 |
| Grant date | Feb 15, 2005 |
| Priority date | — |
| Expiry date | Nov 24, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Methods are disclosed for printing (2-7) multilayer electronic components, and circuits on a surface (2), where at least one of the layers is formed by a redox reaction (6) occurring in a deposited solution (4, 5). Electronic components may comprise semiconductors such as in transistors or diode, or metal oxide or electrolyte such as in batteries or fuel cells, or are capacitors, inductors, and resistors. Preferably, the oxidizer of the redox reaction is a strong oxidizer, and the reducer is a strong reducer (3). Reactions are preferably sufficiently exothermic that they can be initiated (6), rather than driven to completion, by microwave or other suitable energy sources, and may yield substantially pure metal or metal oxide layers. The solution being deposited (5) may have either high concentrations of particulates, such as 60-80 wt. % of dry weight, or low concentrations of particulates, such as ≦5 wt. % or ≦2 wt. %. Low particulate content provides printing of structures having lateral resolution of ≦10 μm, ≦5 μm, or ≦1 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.