Copper paste and wiring board using the same
US6855399B2 · kind B2 · utility
4Cited by
8References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2003 |
| Grant date | Feb 15, 2005 |
| Priority date | — |
| Expiry date | Jul 17, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/252
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wiring board obtained by filling a copper paste in a via hole formed on a ceramic green sheet and firing it to form an insulating layer and a via conductor, the copper paste comprising a copper powder, an organic vehicle and at least one selected from the group consisting of: a ceramic particle having an average particle size of 100 nm or less; and an Fe2O3 particle, wherein the copper paste comprises from 6 to 20 parts by mass of the organic vehicle per 100 parts by mass of the copper powder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.