Detachable adhesive compounds

US6855760B1 · kind B1 · utility

Assignee

• Henkel Kommanditgesellschaft auf Aktien · DE

Inventors

• Christian Kirsten · Burscheid, DE
• Peter Christophliemk · Düsseldorf, DE
• Ralph Nonninger · Saarburg, DE
• Herrmann Schirra · Riegelsberg, DE
• Helmut Schmidt · Riegelsberg, DE

Key dates

• Filing date: May 17, 2000
• Grant date: Feb 15, 2005
• Expiry date: May 17, 2020

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S977/838
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

This invention relates to adhesive compositions of which the binder system contains nanoscale particles with ferromagnetic, ferrimagnetic, superparamagnetic or piezoelectric properties. The invention also relates to dissolvable adhesive bonds and to a process for dissolving adhesive bonds.