Method and apparatus using nanotubes for cooling and grounding die
US6856016B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Jul 2, 2002 |
| Grant date | Feb 15, 2005 |
| Priority date | — |
| Expiry date | Jul 2, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/833
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embodiment of the present invention described and shown in the specification and drawings is a process and a package for facilitating cooling and grounding of a semiconductor die using carbon nanotubes in a thermal interface layer between the die and a thermal management aid. The embodiments that are disclosed have the carbon nanotubes positioned and sized to utilize their high thermal and electrical conductance to facilitate the flow of heat and current to the thermal management aid. One embodiment disclosed has the carbon nanotubes mixed with a paste matrix before being applied. Another disclosed embodiment has the carbon nanotubes grown on the surface of the semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.