Photolithographically-patterned out-of-plane coil structures and method of making
US6856225B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 17, 2000 |
| Grant date | Feb 15, 2005 |
| Priority date | — |
| Expiry date | May 17, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49218
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.