Methods and apparatus for attaching a heat sink to a circuit board component
US6856511B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2003 |
| Grant date | Feb 15, 2005 |
| Priority date | — |
| Expiry date | Jul 17, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A retainer directly attaches to a circuit board component and to a heat sink and secures the circuit board component to the heat sink. The retainer provides a mechanical attachment between the heat sink and the circuit board component. Such mechanical attachment maintains thermal communication between the heat sink and the circuit board component in the absence of a thermally conductive adhesive between the heat sink and the circuit board component for the operational life of the circuit board component. Furthermore, because the retainer attaches directly to the circuit board component and to the heat sink, the retainer minimizes the necessity for use of mounting holes in the circuit board associated with the circuit board component to secure the heat sink to the circuit board component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.