Wireless IC interconnection method and system
US6856788B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2001 |
| Grant date | Feb 15, 2005 |
| Priority date | — |
| Expiry date | Feb 20, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B5/48
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A wireless IC interconnect system and method facilitates interconnections between first and second IC locations via a wireless transmission medium; the IC locations may be on the same chip or on separate chips. A signal to be conveyed is modulated, and the modulated signal is capacitively coupled to the wireless transmission medium—preferably a properly terminated microstrip transmission line (MTL) or a coplanar waveguide (CPW). The modulated signal is capacitively coupled from the wireless medium to a receiver which demodulates the modulated signal and provides the demodulated signal to the second IC location. In a preferred embodiment, the wireless transmission system conveys numerous signals simultaneously, with the signals modulated and demodulated with multiple access algorithms such as code-division (CDMA) and/or frequency-division (FDMA) multiple access algorithms. The interconnection system can be made reconfigurable, with the destinations of the modulated signals changed by reprogramming associated address codes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.