Process for reforming surface of substrate, reformed substrate and apparatus for the same
US6858115B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2003 |
| Grant date | Feb 22, 2005 |
| Priority date | — |
| Expiry date | May 20, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/28
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Sputtering particles are deposited immediately after activating a surface of a substrate composed of a carbon-containing material. Accordingly, a process for reforming a surface of a substrate, a substrate with a reformed surface, and an apparatus therefor are provided in which the depositability and adhesiveness of the sputtering particles are improved. A vacuum ultraviolet light is generated by a laser beam. A surface of a substrate composed of a carbon-containing material is exposed to the generated vacuum ultraviolet light. As a result, the surface of the substrate is activated. Simultaneously therewith, a sputtering particles-generating device generates sputtering particles, such as neutral atoms, ions and clusters. The resultant sputtering particles are deposited on the activated surface of the substrate. Since the sputtering particles are deposited immediately after the surface of the substrate is activated, they are adhered firmly on the surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.