Mobile plating system and method
US6858119B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2003 |
| Grant date | Feb 22, 2005 |
| Priority date | — |
| Expiry date | Jan 6, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/32
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An exemplary mobile plating system is provided for performing a plating process using virtually any known or available deposition technology for coating or plating as substrate. The mobile plating system may include a vacuum chamber positioned in a mobile storage volume, an external vacuum pump, and a control circuitry to control the operation of some or all of the operations of the external vacuum pump. The external vacuum pump is positioned in the mobile storage volume when the mobile plating system is in transit, and is positioned external to the mobile storage volume when the mobile plating system is stationary and in operation. The external vacuum pump may be mounted on a skid, and, in operation, the external vacuum pump couples with the vacuum chamber to assist with producing a desired pressure in the vacuum chamber. The external vacuum pump couples with the vacuum chamber using a flexible piping segment and/or dampening arrangement to reduce and/or eliminate any mechanical vibrations within the vacuum chamber and within the mobile storage volume due to the operation of the external vacuum pump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.