Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
US6858124B2 · kind B2 · utility
19Cited by
15References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2002 |
| Grant date | Feb 22, 2005 |
| Priority date | — |
| Expiry date | Sep 4, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides methods of polishing and/or cleaning copper interconnects using sulfonic acid compositions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.