Metal/ceramic bonding article and method for producing same
US6858151B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2002 |
| Grant date | Feb 22, 2005 |
| Priority date | — |
| Expiry date | Sep 25, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There is provided a method for producing a metal/ceramic bonding article, the method including the steps of: bonding a metal plate 12 of an alloy containing copper and nickel directly to at least one side of a ceramic substrate 10; applying a resist 14 on a predetermined portion of the metal plate 12 to remove an undesired portion of the metal plate 12 by etching; and removing the resist 14 to form a pattern having a predetermined shape of the alloy on the ceramic substrate 10. According to this method, it is possible to reduce the displacement failure of parts to improve productivity and to prevent bonding failure during the mounting of a semiconductor device or the like thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.