Curable sealant composition
US6858260B2 · kind B2 · utility
16Cited by
36References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 6, 2002 |
| Grant date | Feb 22, 2005 |
| Priority date | — |
| Expiry date | Aug 3, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K2200/0655
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A radiation curable, flexible, paintable composition produced from epoxy compounds and one or more polyol(s) has enhanced durability, thick and thin film adhesion, resistance to mold growth and dimensional changes while reducing solvent emissions. The composition can reduce, if not eliminate, runs and drips during the thermal bake cycles which are associated with using conventional compositions in automotive applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.